MANUFACTURING PRINTED CIRCUITS

 

Please find below all the technologies mastered by our company :

  • 1 to 42 layers
  • Multilayer Rigid, Flex and Flex-rigid standards and Multi-pressings
  • FR4 materials - HTG 170 ° -180 ° - flexible and rigid POLYIMIDE - High Frequencies: ROGERS, Teflon etc ... Specific request
  • Finish: HAL SnPb, HAL Lead Free, Sn chemical NI / AU chemical and electrolytic, OSP
  • substrate thickness: 0.2 to 8 mm
  • Copper up to 435 microns thick
  • Minimum tracks and isolates: 35 microns
  • Drilling Minimum: 75 microns by 150 microns and laser drilling blind holes in traditional and buried (circuits High Density Interconnect)
  • Maximum size of the panels: 800 * 1200 mm (more on request)
  • Controlled impedances: guaranteed up to + or - 5% with coupon supply test and measurement report. We can design your stack (calculation of dielectric thicknesses and track / isolation widths) and you provide to meet your specifications (material used and impedance characteristics of the circuit)
  • Soldermask and silkscreen: color choices
  • peelable varnish

 Our specific technologies :

  • Printed circuit-HDI (High Density Interconnect)
  • Via in padVia in pad (capped via)
  • μvia Copper Filling
  • Via plugged with non-conductive paste, copper, solder mask or via filler SD-2361 "Peters"
  • Stacked μvia
  • LDI - LPI and horizontal metallization for complex products
  • White class room 1000/10 000/100 000 for complex maps
  • Possibility of using different substrates on the same card through technology "laser adjustment" of our press

 

 Certifications & Standards: UL, ISO 9001: 2008, ISO 14001: 2004, IPC class 1,2 and 3, ROHS, REACH, others on request ...